| 标题 |
Effect of Anionic Surfactants on the Stability of Alumina Abrasives in Copper Chemical Mechanical Planarization Slurries
阴离子表面活性剂对铜化学机械平坦化浆料中氧化铝磨料稳定性的影响
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| 其它 | Kim, H.; Park, J.; Lee, S. Effect of Anionic Surfactants on the Stability of Alumina Abrasives in Copper Chemical Mechanical Planarization Slurries, Journal of The Electrochemical Society, 2010, 157(5), H512 |
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