可伸缩电子设备
材料科学
数码产品
柔性电子器件
可塑性
变形(气象学)
纳米技术
结构材料
导电体
机械工程
工程物理
复合材料
电气工程
工程类
作者
Dongqi An,Guangping Gong,Dian Xu,Zanxin Zhou,Rui Li,Yewang Su
标识
DOI:10.1002/adfm.202412796
摘要
Abstract Metallic materials serving as indispensable conductors critically influence the performance of flexible electronics. Conventional structural designs have restricted metallic materials to exhibiting pure elastic deformation, but recent developments have emphasized an increased significance of plastic deformation, showing great potential for new breakthroughs in developing novel flexible electronics. This review first introduces the elastoplastic behavior of metallic materials, especially those capable of withstanding remarkable plastic deformation. The main design strategies toward flexible and stretchable electronics expanding elastic deformation range are then summarized, incorporating both strain alleviation and strain delocalization. Innovative studies exploiting plasticity for enhancing device performances or achieving shape‐forming and reconfigurable electronics are further highlighted. Some perspectives on utilizing the elastoplastic behavior of metallic materials to innovate the next generation of flexible electronics are finally provided.
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