材料科学
石墨烯
热导率
电子设备和系统的热管理
复合材料
导电体
填料(材料)
聚合物
热的
纳米技术
机械工程
物理
工程类
气象学
作者
Ni Wu,Sai Che,Huawei Li,Chaonan Wang,Xiaojuan Tian,Yongfeng Li
标识
DOI:10.1016/s1872-5805(21)60089-6
摘要
As the power consumption and heat generation of electronic devices continue to increase, higher demands are being placed on thermal management materials for heat dissipation. Graphene has been widely used as a thermally conductive filler to improve the thermal conductivity of polymers. However, the poor dispersibility of graphene nanoplates in polymers dramatically limits their practical use in thermal management. A promising strategy to increase the thermal conductivity of polymer composites is to construct interconnected three-dimensional graphene networks. This review summarizes the recent advances in the construction and applications of three-dimensional graphene-based polymer composites and ways to improve their thermal conductivity. The current challenges and prospects for the preparation and applications of these materials are considered.
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