材料科学
复合材料
延展性(地球科学)
极限抗拉强度
铜
石墨烯
复合数
纳米孔
烧结
电导率
纳米技术
冶金
物理化学
蠕动
化学
作者
Zhijun Qiao,Tao Zhou,Jianli Kang,Zhenyang Yu,Guoliang Zhang,Ming Li,Lu Huanming,Yong Li,Qin Huang,Lei Wang,Xuerong Zheng,Zhijia Zhang
标识
DOI:10.1016/j.matlet.2018.04.069
摘要
Three-dimensional (3D) interpenetrating network graphene/copper (G/Cu) composites were fabricated by in-situ growth of G on nanoporous Cu followed by rolling and sintering processes. In-situ growth of G network generate an intimate interface between G and Cu matrix, which is not only essential for high load transfer efficiency but also minimize the interfacial resistance. Moreover, the 3D interpenetrating network structure is propitious to fully exert the additional electronic transport pathway and load-bearing of 3D G, as well as helping to generate and store dislocation without initiating cracks. Consequently, the obtained composite exhibits an elegant combination of enhanced tensile strength (354 MPa), extraordinary ductility (16.5% elongation) and robust conductivity (98% IACS).
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