薄脆饼
材料科学
硅
钝化
共发射极
太阳能电池
光电子学
晶体硅
单晶硅
图层(电子)
复合材料
作者
Daming Chen,Yifeng Chen,Zigang Wang,Jian Gong,Chengfa Liu,Yang Zou,Yu Ting He,Yao Wang,Ling Yuan,Wenjie Lin,Rui Xia,Li Yin,Xueling Zhang,Guanchao Xu,Yang Yang,Hui Shen,Zhiqiang Feng,Pietro P. Altermatt,Pierre Verlinden
标识
DOI:10.1016/j.solmat.2019.110258
摘要
We demonstrate an "industrial tunnel oxide passivated contacts" (i-TOPCon) silicon solar cell on large area n-type silicon wafers (156.75 mm × 156.75 mm). This cell has a boron diffused front emitter, a tunnel-SiOx/n+-poly-Si/SiNx:H structure at the rear side, and screen-printed electrodes on both sides. The passivation of the tunnel-SiOx/n+-poly-Si/SiNx:H structure on silicon wafers is investigated. The saturation currents Jo of this structure on polished and textured silicon surfaces are 1.3 and 3.7 fA/cm2, respectively. After printing the Ag contacts, the Jo of this structure increases to 50.7 fA/cm2 on textured silicon surfaces, which is still manageably low for metal contacts. This structure was applied to i-TOPCon solar cells, resulting in a median efficiency of 23.91%, measured in-house, and a champion efficiency of 24.58%, independently confirmed by the ISFH CalTeC in Germany. The champion efficiency was measured with total area illumination, including screen-printed fingers and busbars.
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