计算机冷却
热流密度
水冷
数码产品
电子设备冷却
主动冷却
蒸发冷却器
空气冷却
小型化
机械工程
临界热流密度
传热
热管
被动冷却
电子设备和系统的热管理
材料科学
散热片
核工程
工程类
电气工程
机械
物理
纳米技术
摘要
Heat flux of electronic equipment shows an increasing trend with the increasing demand for miniaturization and high performance. Low heat dissipation capacity makes it difficult to apply air cooling technology to high heat flux electronic devices in the future. At present, liquid cooling technology is the research hotspot of cooling solutions for electronics, mainly because liquid cooling has the advantages of strong fluidity and high heat transfer coefficient. Several kinds of liquid cooling technologies which can be used for cooling electronic equipment are introduced in this paper, among which micro-channel cooling, spray cooling, jet cooling and immersion cooling are emphasized. The working principle and progress in research of each liquid cooling technology are introduced and analyzed. Finally, the future development direction of liquid-based cooling technology is discussed. The problems in the research direction of liquid cooling technology are pointed out. Some suggestions for further research on liquid cooling technology are put forward.
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