Metainterface with mechanical, thermal, and active programming based on programmable orientation-distributed biometric architectonics

生物识别 方向(向量空间) 材料科学 热的 计算机科学 人工智能 物理 几何学 数学 气象学
作者
Zhixiao Gao,Hongze Wang,Pengyuan Ren,Guolong Zheng,Yang Lü,Boyu Peng,Zijue Tang,Yi Wu,Haowei Wang
出处
期刊:Materials horizons [The Royal Society of Chemistry]
标识
DOI:10.1039/d4mh00570h
摘要

Interfaces between different materials crucially determine the performance of multi-material systems, impacting a wide range of industries. Currently, precisely programming interfaces with distinct properties at different localized interface positions remains a challenge, leading to limited interface adaptability and unpredictable interface failures, thus hindering the development of next-generation materials and engineering systems with highly customizable multiphysical interface performances. Our research introduces programmable "metainterfaces" for the first time, featuring engineerable biometric architectonics that allows for mechanically, thermally, and actively programmed distribution of interfacial effects by its orientation, driven by artificial intelligence. Enabled by metainterfaces, we showcased improved mechanical properties of future composite metamaterials by programming interface resistance customized to the decoupling modes of distinct lattice topologies. Additionally, we demonstrate enhanced and programmable impact mechanics in fish scale assemblies equipped with pre-programmed metainterface sheets. The proposed metainterface also allows for coolant flow programming in thermal management systems, opening new avenues for development of highly customizable thermos-mechanical systems. Additionally, we introduce digitally controlled "metadisks" enabled by metainterfaces as novel solutions for actively programmable interface systems in robotics, offering real-time adaptive and intelligent interfacial mechanics. This research sets the foundation for next-generation multi-material systems with precisely programmed interfacial effects, offering broad applicability in areas such as smart materials, advanced thermal management, and intelligent robotics.

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