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Improving the incompatibility between electromagnetic and thermal properties of CNF/Co composites via constructing 3D interconnected frameworks, double hot carriers, and multiple losses

热导率 电介质 材料科学 介电损耗 复合材料 退火(玻璃) 反射损耗 多孔性 热传导 吸收(声学) 光电子学 复合数
作者
Meiwan Ying,Feifei You,Yijun Yang,Kaixia Yang,Shiyang Cai,Guoxiu Tong,Hui Zan,Dabo Chen,Wenhua Wu
出处
期刊:Journal of Alloys and Compounds [Elsevier BV]
卷期号:983: 173776-173776 被引量:5
标识
DOI:10.1016/j.jallcom.2024.173776
摘要

To improve the incompatibility between thermal conduction and electromagnetic wave absorption properties, 3D interconnected CNF/Co composites as a multifunctional filler were fabricated with magnetic/dielectric dual loss and phonon/electron co-transfer via a straightforward sol-gel and annealing route. Results show that the CNF/Co composites produced at a high Co2+ concentration (c) exhibit low defects, small SBET, large electrical conductivity, and high Co content. The optimal comprehensive properties of CNF/Co composites are achieved at c=0.8 M. Besides, the CNF/Co composites bear a large thermal conductivity (3.61 W/mK) at a low load (15 wt.%) due to the enhanced phonon/electron co-transfer in 3D interconnected CNF frameworks and decreased phonon scattering. Moreover, the CNF/Co composites demonstrate tunable electrical conductivity (σ = 7.53×10-5 ~ 1.22×10-2 S/cm) and significant enhancements in electromagnetic wave absorption properties (4.53 GHz/mm, 2.4 mm thickness, 35% load), outperforming most other previously reported materials. The significant enhancements could be attributed to the high attenuation and excellent impedance matching caused by magnetic/dielectric dual-loss Co and 3D interconnected porous frameworks. The exceptional electromagnetic wave absorption properties and thermal conduction endow the 3D interconnected CNF/Co composites with prospective application as a multifunctional filler in modern electronics. 3D interconnected CNF/Co composites were synthesized via a straightforward sol-gel and annealing route, exhibiting a synchronous enhancement in heat conductance and EMW absorption.
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