生产线后端
堆栈(抽象数据类型)
热的
材料科学
表征(材料科学)
电子工程
电介质
图层(电子)
CMOS芯片
计算机科学
光电子学
工程类
纳米技术
物理
气象学
程序设计语言
作者
Xinyue Chang,Herman Oprins,Melina Lofrano,Vladimir Cherman,Bjorn Vermeersch,Javier Díaz Fortuny,Seong-Ho Park,Zsolt Tőkei,Ingrid De Wolf
标识
DOI:10.1109/iitc/mam57687.2023.10154768
摘要
In this work, we present a fast evaluation methodology to aid the thermal-aware BEOL design with a quick estimation of out-of-plane layer equivalent thermal properties based on design rules for dimensions and densities. The method is calibrated with a detailed FE thermal simulation and is applicable to realistic back-end-of-line (BEOL) connectivity. With this method, a breakdown analysis is performed on an advanced 3 nm 14-layer BEOL stack. Thermal contributions of individual layers and impacts of dielectric and metallization choices are benchmarked. Furthermore, a dedicated multi-layer BEOL test vehicle is designed in a 28nm foundry CMOS technology. The out-of-plane thermal coupling is experimentally characterized, and consistent measurement and modeling results are obtained.
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