A novel heat dissipation structure for PSiP package

In this paper, an innovative embedded chip package structure is proposed to achieve highly-efficient heat dissipation. The chip is connected on both sides and the heat sink is integrated in the module, which simplifies the assembly process. The size of the noval PSiP (Power Supply in Package) is 9*7.64*0.6 mm. An array of copper column with a height of 200 um is directly formed on the back surface of the chip through multi-plating steps. The simulation results show that the heat dissipation capability of the new structure is improved by 5% to 20% compared with that of the traditional structure. In addition, three-point bending tests show that the new structure has a 20% improvement in electrical performance and a 9.5% improvement in physical limit performance. The assembly cost is reduced by 20% to 30% due to the elimination of the heat sink assembly.