球栅阵列
倒装芯片
材料科学
热冲击
焊接
复合材料
热膨胀
休克(循环)
温度循环
可靠性(半导体)
热的
热力学
物理
内科学
功率(物理)
医学
胶粘剂
图层(电子)
作者
Kyung-Yeol Kim,Haksan Jeong,Sang‐Woo Kim,Jae-Oh Bang,Seung‐Boo Jung
出处
期刊:Journal of welding and joining (Online)
[The Korean Welding and Joining Society]
日期:2020-04-22
被引量:1
标识
DOI:10.5781/jwj.2020.38.2.3
摘要
The reliability of a BGA component packaged with underfill and cornerfill was evaluated by 3-point bend test under two thermal shock conditions. The BGA component packaged with cornerfill failed before 500 cycles at a temperature range of -40 ~ 125 °C. Crack propagation occurred between the Sn3.0-Ag0.5Cu solder and (Cu, Ni)6Sn5 intermetallic compound of the BGA component side. Both the BGA components packaged with soldering and underfill passed the thermal shock test under two conditions. However, the SAC305 BGA component assembled with cornerfill only passed a thermal shock in the range of –40 ~ 85 °C. After 2,000 thermal shock cycles under two temperature conditions, bending reliability was evaluated by 3-point bend test. The SAC305 BGA component packaged with underfill showed superior bending reliability of over 3,000 bend cycles. The early failure (before 500 thermal cycles) of the SAC305 BGA component assembled by cornerfill was considered to be related to the coefficient of thermal expansion (CTE) and glass transition temperature (Tg) of the cornerfill material. Key words: SAC305, Underfill, Cornerfill, 3-point bend test, Thermal shock test
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