Controllable Single Crystal Copper Morphology on Copper Foil By Electrodeposition

The Copper foil have been developed for a long time in history. Nowadays, the requirements of the copper foil used for various electrical products and applications in our life. Electrodeposited (ED) copper foils with excellent electrical characteristics and a low cost would be a promising candidate to replace rolled copper foils. In this work, ED copper foils were fabricated in a bubble flow plating bath at 25°C. Three additives were used in the copper plating solution, which can control the surface morphology on the ED copper foil. The interaction of these additives directly influence the surface morphology with distinct structure and roughness. The surface morphologies, roughness and structure orientation of these ED copper foils were characterized by SEM, TEM and XRD, respectively. As a result, controllable copper morphology (i.e., copper nodules) deposited on the ED copper foil was single crystal copper, which possesses better electric and thermal conductivity. The special structure extends the applications of the ED copper foil in next generation.