Study of thawing behavior of liquid metal used as computer chip coolant

冷却液 液态金属 材料科学 冷藏车 计算机冷却 核工程 传热 热的 机械工程 机械 热力学 电子设备和系统的热管理 复合材料 物理 工程类
作者
Kun Quan,Jing Liu,Xiang Shi,Kai Xie,Yi Zhou
出处
期刊:International Journal of Thermal Sciences [Elsevier]
卷期号:48 (5): 964-974 被引量:13
标识
DOI:10.1016/j.ijthermalsci.2008.08.005
摘要

Liquid metal has recently been identified as an excellent coolant for the thermal management of computer chip. However, in an extremely low temperature environment, the liquid metals may subject to solidification due to local freezing, which may possibly cause failure of their flowing role in transferring heat away. To resolve this potential difficulty, we proposed here to quickly melt the frozen coolant by implanting in advance a wire heater into the liquid metal. A theoretical model was set up to characterize such phase change heat transfer problem through introduction of moving heat source principle. And a closed form analytical solution was obtained using Green's function under several typical boundary conditions. Meanwhile, proof-of-concept experiments were also performed in a refrigerator closet to validate the theoretical prediction. Both theoretical results and experimental measurements reveal that, the frozen metal can be successfully thawed within several dozens of seconds. This would guarantee a quick start and highly safe running of liquid metal for computer chip cooling.
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