Patterned deposition by plasma enhanced spatial atomic layer deposition

Abstract An atmospheric pressure plasma enhanced atomic layer deposition reactor has been developed, to deposit Al 2 O 3 films from trimethyl aluminum and an He/O 2 plasma. This technique can be used for 2D patterned deposition in a single in‐line process by making use of switched localized plasma sources. It was observed that the sharpness of the patterns is primarily influenced by the concentration of reactive plasma species and by the dimensions of the plasma source. (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)