热导率
热阻
材料科学
热的
电子设备和系统的热管理
消散
印刷电路板
有限元法
机械工程
造型(装饰)
电子包装
机械
复合材料
热力学
工程类
物理
电气工程
作者
Jin-Feng Huang,Zhenzhi He,Hector Gutiérrez,Libo Zhao,Xiangning Lu
出处
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology
[Institute of Electrical and Electronics Engineers]
日期:2021-08-06
卷期号:11 (9): 1461-1470
被引量:1
标识
DOI:10.1109/tcpmt.2021.3103098
摘要
Heat dissipation of the fan-out (FO) package is a primary concern in advanced electronic packaging. It is a challenge to characterize the thermal performance using the actual geometry of the FO package due to the complex structure and time-consuming calculations. A simplified FO model was constructed based on the equivalent material principle and the mathematical FO model was validated by using the finite element (FE) simulation. Then FO-package thermal resistance network (FO-TRN) was established to evaluate the thermal performance, which was proven efficient and accurate by the simulation of FE models. The influence of the critical dimension (CD) of redistribution line (RDL), the thermal conductivity of molding material, and the printed circuit board (PCB) area were also investigated by using the FE simulation and FO-TRN calculation. The results demonstrated that the smaller the CD of RDLs, the greater the thermal resistance of the FO package. The high thermal conductivity of the molding compound and large PCB area is beneficial for heat dissipation. The simplified FO model and FO-TRN are practicable and effective for thermal characterization and management.
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