Simulation Study on Ultrasonic Lapping Trajectory of Ceramic Materials

Hard brittle materials have been popular used in manufacture experience because of the excellent performances. However the low plasticity, frangibility and non-conduction make the machining very difficult. Therefore, ultrasonic vibration was introduced to common lapping for the purpose of higher removal rate and fine surface quality. The acoustic model of ultrasonic lapping was proposed, the track equations of ultrasonic lapping with different vibration modes were deduced, the influencing factors of lapping tracks were obtained, and the lapping tracks with different lapping parameters had been emulated. It can be concluded that ultrasonic lapping is a high efficient processing method adapting to ceramic materials.