Strain field measurements over 3000 °C using 3D-Digital image correlation

材料科学 数字图像相关 温度测量 光学 变形(气象学) 斑点图案 黑体辐射 光电子学 复合材料 辐射 物理 量子力学
作者
Zhiwei Pan,Shenghong Huang,Yong Su,Meixia Qiao,Qingchuan Zhang
出处
期刊:Optics and Lasers in Engineering [Elsevier BV]
卷期号:127: 105942-105942 被引量:57
标识
DOI:10.1016/j.optlaseng.2019.105942
摘要

With the development of aerospace and fusion engineering, understanding the mechanical behavior of materials under high-temperature conditions has become increasingly important. However, few studies are devoted to the ultra-high temperature range of 2000–3000 °C. In this study, with the aim of developing non-contact measuring techniques of mechanical deformation under ultra-high temperature, a high heat flux (~300 MW) comprehensive experimental platform is established, which includes a vacuum chamber, a three-dimensional digital image correlation (3D-DIC) system, infrared radiation thermometers and an electron beam heating system. Using the electron beam heating technique, the tungsten specimen can be heated to over 3000 °C. Owing to the use of a vacuum chamber, the thermally induced airflow disturbance at high temperature can be completely removed. Tantalum carbide (TaC) powder is chosen as the speckle material and speckle fabrication technology is developed to adapt ultra-high temperatures under vacuum conditions. In order to suppress the blackbody radiation at high temperature, three schemes based on blue light sources, self-radiating light sources and a dual wavelength optical filter technique are designed for three temperature ranges from room temperature to 3067 °C. Afterwards, full-field thermal deformation of the tungsten specimen above 3000 °C was determined based on the above strategies using the 3D-DIC technique. The feasibility and accuracy of the proposed methods are verified by comparing the measurement results with the thermal expansion strain data and model from available databases and literature. The standard deviations in different temperature intervals are 50 με for 25–1200 °C, 100–200 με for 1200–1800 °C and less than 500 με for 1800–3067 °C. The proposed methods and technologies are expected to lay a foundation for further developments in strain field measurements at ultra-high temperature.

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