材料科学                        
                
                                
                        
                            热冲击                        
                
                                
                        
                            热的                        
                
                                
                        
                            热传导                        
                
                                
                        
                            多物理                        
                
                                
                        
                            复合材料                        
                
                                
                        
                            断裂力学                        
                
                                
                        
                            传热                        
                
                                
                        
                            GSM演进的增强数据速率                        
                
                                
                        
                            有限元法                        
                
                                
                        
                            材料性能                        
                
                                
                        
                            机械                        
                
                                
                        
                            结构工程                        
                
                                
                        
                            计算机科学                        
                
                                
                        
                            工程类                        
                
                                
                        
                            物理                        
                
                                
                        
                            电信                        
                
                                
                        
                            气象学                        
                
                        
                    
            作者
            
                Han Du,Hongwei Fan,Chengzeng Yan,Tie Wang,Yang Yu,Saqib Ali,Gang Wang            
         
                    
            出处
            
                                    期刊:Applied sciences
                                                         [Multidisciplinary Digital Publishing Institute]
                                                        日期:2022-11-30
                                                        卷期号:12 (23): 12279-12279
                                                        被引量:8
                                 
         
        
    
            
        
                
            摘要
            
            In this paper, the steady-state and transient heat transfer processes of functionally graded materials (FGMs) are analyzed using a coupled thermo-mechanical model in a GPU parallel multiphysics finite–discrete element software, namely MultiFracS. First, the coupled model to handle the heat transfer problem of heterogeneous materials is verified. Then, the advantages and disadvantages of FGMs and composite materials in response to thermal shock loads are compared and the results indicate that FGMs can overcome extreme environments better than composite materials. Finally, the influence of the geometric distribution characteristics of the double-edge cracks in the gradient material plate on the crack propagation is analyzed. The simulation results show that the interaction between the cracks affects the crack propagation path under the thermal load. The inclination angle and spacing of double-edge cracks greatly influence crack propagation. Specifically, a larger inclination angle and spacing can lead to a smaller crack propagation angle. The approach in this paper provides a new quantitative tool for investigating the thermal, elastic, and cracking of functionally graded materials.
         
            
 
                 
                
                    
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