材料科学
电磁屏蔽
复合材料
电磁干扰
数码产品
复合数
电磁干扰
图层(电子)
涂层
纳米复合材料
柔性电子器件
极限抗拉强度
光电子学
电子工程
电气工程
工程类
作者
Yifei Qu,Li Xiang,Xiu Wang,Hongqi Dai
标识
DOI:10.1016/j.compscitech.2022.109753
摘要
The electromagnetic interference and heat accumulation pose a significant challenge for the traditional high-density single-function electromagnetic shielding materials in advanced flexible integrated electronics. Herein, nano-silver flakes (AgNFs, reflective layer), MXene (Ti3CNTx, loss layer) and silver nanowires (AgNWs, heat conduction and shielding layer) constructed ordered multi heterogeneous layers high-performance flexible electromagnetic shielding functional composites (AMA composites). Especially the composites exhibited outstanding electromagnetic interference shielding efficiency (EMI SE) of 70.96 dB even with an extremely thin coating of 25 g/m2, which is 350% higher than that of the commercial standard (20 dB). It is worth noting that the AMA composites also possessed certain qualities such as superior thermal conductivity, flame retardancy, chemical resistance, high-temperature resistance (25 °C–100 °C), and mechanical properties (tensile strength of 44.4 MPa, Young's modulus of 0.6 GPa). The composites display application possibilities in highly integrated advanced flexible electronic products and wearable electronic devices, as well as provide structural design and research ideas for the usage of a new MXene material (Ti3CNTx) in electromagnetic shielding composite materials.
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