Monolithic Integration of Full‐Color Microdisplay Screen with Sub‐5 µm Quantum‐Dot Pixels

Abstract Monolithic integration of color‐conversion materials onto blue‐backlight micro‐light‐emitting‐diodes (micro‐LEDs) has emerged as a promising strategy for achieving full‐color microdisplay devices. However, this approach still encounters challenges such as the blue‐backlight leakage and the poor fabrication yield rate due to unsatisfied quantum dot (QD) material and fabrication process. Here, the monolithic integration of 0.39‐inch micro‐display screens displaying colorful pictures and videos are demonstrated, which are enabled by creating interfacial chemical bonds for wafer‐scale adhesion of sub‐5 µm QD‐pixels on blue‐backlight micro‐LED wafer. The ligand molecule with chlorosulfonyl and silane groups is selected as the synthesis ligand and surface treatment material, facilitating the preparation of high‐efficiency QD photoresist and the formation of robust chemical bonds for pixel integration. This is a leading record in micro‐display devices achieving the highest brightness larger than 400 thousand nits, the ultrahigh resolution of 3300 PPI, the wide color gamut of 130.4% NTSC, and the ultimate performance of service life exceeding 1000 h. These results extend the mature integrated circuit technique into the manufacture of micro‐display device, which also lead the road of industrialization process of full‐color micro‐LEDs.