Understanding and Mitigating Temperature-Induced Agglomeration in Silica-based Chemical Mechanical Planarization (CMP) Slurry Storage

This study explores the impact of temperature on silica particle agglomeration in Chemical Mechanical Planarization (CMP) slurries during storage. Slurries were stored at 15 °C, room temperature, and 45 °C, and analyzed. ATR-FTIR, RAMAN, SEM, zeta potential, and LPC were employed providing qualitative and quantitative data on slurry stability and agglomeration tendencies. Elevated temperature storage significantly increased agglomeration and large particle counts with particle counts value of ~1.2×107 Part./ml, likely due to water molecule dehydration leading to destabilization. Low-temperature storage also induced agglomeration but to a lesser extent with particle counts the value of ~4.0×106 Part./ml compared with the RT (~2.0×106 Part./ml). Short-term storage yielded soft agglomerates with LPC of ~(2.0-4.0)×106 Part./ml, while long-term high-temperature storage led to hard agglomerates with LPC of ~3.0×107 Part./ml. The ATR-FTIR and Raman analysis indicate that the spectroscopic features of the original slurry exhibited changes upon variation of storage temperature from RT to 15 and 45 oC. The study also explored the reversibility of agglomeration post-treatment, indicating a potential mitigation pathway. The results demonstrated an inverse relationship between temperature and dissolved oxygen (DO) in silica slurries. For example. the curves depict a decrease in oxygen content from ~10 ppm at RT to 7 ppm at 45 oC with increasing aging time. A mechanism outlining the temperature and aging-induced agglomeration was proposed, linking temperature fluctuations and thermodynamic aspects to colloidal stability. These findings offer a robust understanding of temperature-induced agglomeration in silica-based CMP slurry storage, paving the way for developing strategies to alleviate these issues and ensuring consistent CMP performance in semiconductor manufacturing.