氧化铟锡
材料科学
薄膜晶体管
光电子学
锡
击穿电压
铟
晶体管
图层(电子)
电气工程
纳米技术
电压
工程类
冶金
作者
Wangran Wu,Tingrui Huang,Guangan Yang,Jie Cao,Zuoxu Yu,Huabin Sun,Yong Xu,Weifeng Sun
标识
DOI:10.1109/led.2024.3394888
摘要
Indium-tin-oxide (ITO) possesses high carrier mobility and a wide bandgap, which is a promising candidate for fabricating high-voltage (HV) thin-film transistors (TFTs) with a low on-resistance. No reports exist on HV ITO TFTs due to the limitation of the traditional TFT structure. This paper presents HV ITO TFTs featuring a drift region situated between the gate and drain. A 6-nm thick ITO channel is used, with the drift region spanning from 4 μm to 20 μm, encapsulated by an ITO layer ranging in thickness from 0 nm to 20 nm. Finally, an HV ITO TFT with a breakdown voltage (V BD ) of 448 V and a low specific on-resistance (R on, sp ) of 147 mΩ·cm 2 is realized. The trade-off relationship between V BD and R on,sp of proposed HV ITO TFTs approaches the theoretical limit of the single-RESURF lateral double-diffused MOSFET (LDMOS).
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