材料科学
X射线光电子能谱
光致发光
溅射
光电子学
透射电子显微镜
分析化学(期刊)
肖特基二极管
溅射沉积
氮化物
肖特基势垒
电极
薄膜
图层(电子)
纳米技术
化学工程
二极管
化学
工程类
物理化学
色谱法
作者
Dandan Wen,Yue Shen,PeiYang Sun,Jian Huang,Feng Gu,Linjun Wang
标识
DOI:10.1088/1361-6641/ac889a
摘要
Abstract Aluminum nitride (AlN) films with low defect concentration were fabricated on Si substrates via RF magnetron sputtering system based on Al-rich AlN (Al-AlN) targets. The effects of Al-rich content on structure, defects and photoelectric properties of AlN films were investigated by x-ray diffraction (XRD), high resolution transmission electron microscopy, x-ray photoelectron spectroscopy (XPS), low temperature photoluminescence (PL), ultraviolet-visible spectra, current–voltage ( I – V ) and capacitance–voltage ( C – V ) characteristics. In particular, the defects of AlN films were investigated by XPS and low-temperature PL analyses, indicating that Al-rich AlN targets can help to reduce the defects of Al vacancy and O impurity of AlN films with an optimal Al-rich content of 1.5 wt. % (A1.5). Schottky contact behavior between AlN films and Ti/Al/Ni/Au multi-layer electrodes were revealed from I – V curves of all samples based on parallel electrodes, and AlN metal-semiconductor-metal (MSM) devices prepared by A1.5 films exhibited the lowest leakage current of 2.43 × 10 −8 A at the bias of 5 V. C – V tests indicate the less defect density and lower carrier concentrations of vertical structure of A1.5 devices. This work offers a feasible approach to regulate the defects of AlN films for practical application.
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