流变学
材料科学
粘附
胶粘剂
压力敏感
复合材料
共聚物
体积分数
高分子科学
聚合物
图层(电子)
作者
G. Marin,Christophe Dérail
标识
DOI:10.1080/00218460600713618
摘要
Abstract We have studied the relationship between rheological and peeling properties for hot-melt pressure-sensitive adhesives based on homopolymers or copolymers blended with tackifying resins. In this article, we particularly try to demonstrate that it is possible to define a quantitative link between rheology and adherence when the model formulations are deposited on substrates with strong (thermodynamic) adhesion. We describe the experimental results obtained on these model formulations and discuss the quantitative relationships obtained. In the case of “adhesion modulation” (derived from different treatments of the substrates), we show that the relationships become much more complicated, even with the same model adhesives. At the end, we discuss on the competition between adhesion and dissipation in the case of poor adhesion. Keywords: Block copolymersHomopolymersHot-melt pressure-sensitive adhesiveMaster curveNoisePeeling propertiesPressure-sensitive adhesiveRheological propertiesStick–slipTapeTerminal relaxation timeTime–temperature equivalence Notes Ratio–Volume Fraction in the Blend One of a collection of papers honoring Hugh R. Brown, who received The Adhesion Society Award for Excellence in Adhesion Science, Sponsored by 3M, in February 2006.
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