原子层沉积
材料科学
数码产品
晶体管
薄膜
半导体
光电子学
薄膜晶体管
纳米技术
柔性电子器件
沉积(地质)
电介质
图层(电子)
工程物理
电气工程
工程类
电压
古生物学
生物
沉积物
作者
David H. Levy,Shelby F. Nelson
出处
期刊:Journal of vacuum science & technology
[American Institute of Physics]
日期:2011-12-14
卷期号:30 (1)
被引量:31
摘要
Atomic layer deposition (ALD) produces conformal films with low defects and a high degree of thickness control. Many applications leverage these properties to yield excellent dielectrics and barrier layers. In recent years, ALD has been exploited to produce thin-film transistors, in which the technique is capable of producing all of the layers required, including the semiconductor. This perspective will examine the state-of-the-art use of ALD to produce thin-film electronics, notably the zinc oxide-based thin-film transistor. It is critical that the ZnO-based semiconductor material have sufficiently high resistivity in order to yield transistors with low off current and good switching characteristics. The nature of this problem and the approaches used to address it will be discussed. The use of rapid deposition technologies, such as spatial ALD, also has a strong impact on the quality of the ZnO semiconductor. Finally, demonstrations of various thin film electronics devices and systems produced by ALD will be reviewed.
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