聚氨酯
胶粘剂
材料科学
复合材料
水分
聚合
含水量
扫描电子显微镜
分层(地质)
聚合度
聚合物
工程类
古生物学
生物
构造学
岩土工程
俯冲
图层(电子)
作者
F. Beaud,Peter Niemz,A. Pizzi
摘要
Abstract The causes of strength loss of wood joints and their consequent delamination from one‐component polyurethane adhesives used for bonding structural wood when used at a low moisture content was investigated by testing wood joint strength and elongation at rupture at different wood moisture contents and by 13 C‐NMR spectroscopy and scanning electron microscopy of the hardened bond line. The combination of the relative proportion of the still‐reactive free NCO groups on the polyurethane, of the wise choice of degree of polymerization of the resin, and of a slower rate of reaction were the three parameters found to be important in overcoming the problem of poor or no bonding of wood at low to very low moisture contents from one‐component polyurethane adhesives. The results obtained indicated that one‐component polyurethane adhesives that had a combination of a higher proportion of still‐unreacted NCO groups, a lower degree of polymerization, and a slower reaction rate were capable of overcoming the problem of the high sensitivity of polyurethane gluing at low to very low wood moisture contents. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4181–4192, 2006
科研通智能强力驱动
Strongly Powered by AbleSci AI