硒化物
活化能
扩散
铜
空位缺陷
电阻率和电导率
热传导
离子键合
化学
菲克扩散定律
离子电导率
材料科学
凝聚态物理
硒
热力学
离子
物理化学
结晶学
电极
物理
电解质
有机化学
量子力学
复合材料
作者
B. Čelustka,Z. Ogorelec
标识
DOI:10.1016/0022-3697(66)90067-9
摘要
Electrical conduction and diffusion of copper vacancies in nonstoichiometric cuprous selenide in the temperature interval from 500°C up to 850°C was examined. It was found that ionic component of total conductivity is about 5% at 700°C. The diffusion constant of the copper vacancies has extremely high absolute values. Its temperature dependence can be described by the equation D = 0·36 exp(−0·27kT) which gives the energy of activation for vacancy diffusion equal to 0·27 eV.
科研通智能强力驱动
Strongly Powered by AbleSci AI