Optimal Design of Thermal Characteristics Based on Orthogonal Experimental Design Method

As power consumption of the stacked SiP chip continues to increase, the T j (junction temperature) increases accordingly and eventually causes overheat and fail, thence it is necessary to optimize the thermal performance of the chip. In this paper, the orthogonal experimental design method is utilized to improve the thermal characteristics of the stacked SiP structure. An L 16 (44×23) orthogonal array is applied to estimate the effects of the seven factors and to reveal the optimal level combination. Adhesive film material and the thickness of adhesive film are the most important factors affecting T j. Ultimately, the optimal design reduces the T j by 8.38% relative to the original design.