石墨烯
材料科学
热导率
复合材料
共价键
聚合物
热的
电导率
纳米技术
化学
物理
物理化学
气象学
有机化学
作者
Qingwei Yan,Jingyao Gao,Ding Chen,Peidi Tao,Lu Chen,Junfeng Ying,Xue Tan,Le Lv,Wen Dai,Fakhr E. Alam,Jinhong Yu,Yuezhong Wang,He Li,Chen Xue,Kazuhito Nishimura,Sudong Wu,Nan Jiang,Cheng‐Te Lin
出处
期刊:Nanoscale
[The Royal Society of Chemistry]
日期:2022-01-01
卷期号:14 (31): 11171-11178
被引量:23
摘要
Combining the advantages of high thermal conductivities and low graphene contents to fabricate polymer composites for applications in thermal management is still a great challenge due to the high defect degree of exfoliated graphene, the poor orientation of graphene in polymer matrices, and the horrible phonon scattering between graphene/graphene and graphene/polymer interfaces. Herein, mesoplasma chemical vapor deposition (CVD) technology was successfully employed to synthesize vertically aligned graphene nanowalls (GNWs), which are covalently bonded by high-quality CVD graphene nanosheets. The unique architecture leads to an excellent thermal enhancement capacity of the GNWs, and a corresponding composite film with a matrix of polyvinylidene fluoride (PVDF) presented a high through-plane thermal conductivity of 12.8 ± 0.77 W m-1 K-1 at a low filler content of 4.0 wt%, resulting in a thermal conductivity enhancement per 1 wt% graphene loading of 1659, which is far superior to that using conventional graphene structures as thermally conductive pathways. In addition, this composite exhibited an excellent capability in cooling a high-power light-emitting diode (LED) device under real application conditions. Our finding provides a new route to prepare high-performance thermal management materials with low filler loadings via the rational design of the microstructures/interfaces of graphene skeletons.
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