材料科学
缩放比例
电介质
栅极电介质
光电子学
金属浇口
单层
理想(伦理)
阈下摆动
晶体管
摇摆
电气工程
MOSFET
纳米技术
栅氧化层
物理
电压
工程类
数学
哲学
几何学
认识论
声学
作者
Tsung-En Lee,Yuan-Chun Su,Bo-Jiun Lin,Yixuan Chen,Wei‐Sheng Yun,Po‐Hsun Ho,Jer-Fu Wang,Sheng‐Kai Su,Chen-Feng Hsu,Po‐Sen Mao,Yu‐Cheng Chang,Chao-Hsin Chien,Bo-Heng Liu,Chien-Ying Su,Chi‐Chung Kei,Han Wang,H.‐S. Philip Wong,T. Y. Lee,Wen‐Hao Chang,Chao-Ching Cheng,Iuliana Radu
标识
DOI:10.1109/iedm45625.2022.10019552
摘要
Transistor scaling enabled by gate length scaling requires EOT scaling to less than 1 nm thickness [1]. This work successfully integrates Hf-based ALD higher-k dielectrics with CVD-grown monolayer (1L) MoS 2 to build top-gate nFET with EOT ~1 nm with nearly ideal subthreshold swing of 68 mV/dec. The gate stack described here achieves a high $\varepsilon_{\mathrm{e}\mathrm{f}\mathrm{f}}$ ~13.53, a large $\mathrm{E}_{\mathrm{B}\mathrm{D}}$ ~12.4MV/cm, and excellent leakage current density. This is a remarkable performance among reported gate dielectrics on the transition metal dichalcogenides (TMDs) on which it is notoriously difficult to deposit a pinhole-free dielectric.
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