材料科学
热导率
纳米复合材料
导电体
数码产品
氮化硼
柔性电子器件
纳米片
弹性体
复合材料
可伸缩电子设备
热传导
纳米技术
物理化学
化学
作者
Yahui Liang,Nifang Zhao,Weiwei Gao,Hao Bai
出处
期刊:ACS Nano
[American Chemical Society]
日期:2024-03-08
卷期号:18 (11): 8199-8208
被引量:7
标识
DOI:10.1021/acsnano.3c12233
摘要
Thermal management materials have become increasingly crucial for stretchable electronic devices and systems. Drastically different from conventional thermally conductive materials, which are applied at static conditions, thermal management materials for stretchable electronics additionally require strain-insensitive thermal conductivity, as they generally undergo cyclic deformation. However, realizing such a property remains challenging mainly because conventional thermally conductive polymer composites generally lack a mechanically guided design. Here, we report a honeycomb-like nanocomposite with a three-dimensional (3D) thermally conductive network fabricated by an arrayed ice-templating technique followed by elastomer infiltration. The hexagonal honeycomb-like structure with thin, compact walls (≈ 40 μm) endows our composite with a high through-plane thermal conductivity (≈ 1.54 W m–1 K–1) at an ultralow boron nitride nanosheet (BNNS) loading (≈ 0.85 vol %), with an enhancement factor of thermal conductivity up to 820% and thermal-insensitive strain up to 200%, which are 2.7 and 2 times higher than those reported in the literature. We report an intelligent strategy for the development of advanced thermal management materials for high-performance stretchable electronics.
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