晶片切割
轴棱锥
材料科学
贝塞尔光束
光学
梁(结构)
横截面
贝塞尔函数
倒角(几何图形)
激光束
复合材料
激光器
物理
结构工程
几何学
工程类
图层(电子)
数学
作者
Juozas Dudutis,Rokas Stonys,Gediminas Račiukaitis,Paulius Gečys
标识
DOI:10.1016/j.optlastec.2018.10.007
摘要
In this paper the possibility to optimize the glass dicing process by controlling the axicon-generated Bessel beam ellipticity is presented. Single-shot intra-volume modifications in soda-lime glass followed by dicing experiments of 1 mm-thick samples are performed. The Bessel beam ellipticity is essential for glass dicing process. Such beam generates intra-volume modifications with transverse crack propagation in dominant direction. Orientation of these modifications parallel to the dicing direction gives significant advantages in terms of processing speed, glass breaking force and cutting quality.
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