A New Failure Mechanism of Inter Layer Dielectric Crack

引线键合 材料科学 失效模式及影响分析 复合材料 薄脆饼 失效机理 结构工程 炸薯条 电气工程 光电子学 工程类
作者
Haiyan Liu,Xiangyang Li,Sean Xin Xu,Jun Li
标识
DOI:10.1109/eptc.2018.8654345
摘要

Converting gold wire to copper wire for IC packaging is a big trend recently which has both advantage and disadvantage. Cu wire is good for packaging cost saving to current semiconductor industry, but it may also create quality and reliability issues. Since Cu is much harder and stiffer material than Au, it may require a greater force and USG power to insure good bonding to pad, and a larger bond force and USG power in turn increases the risk of ILD crack during the bonding process. The wafer tech in this study is CMOS40nm, Al thickness is 28KA, with 53um pad opening. The ILD crack mechanism which is discussed in this paper is different. The failure mode during ATE test is leakage failure. After de-cap and cratering test, there is no cratering/damage on failed pad under microscope check. FIB was performed on failed pad and confirmed the damage between Metal 2 and Metal 3, and no damage on top metal. The link between IV curve trace and ILD crack was studied. The root cause of the ILD crack was studied, material and machine variation were also take into consideration. Parameter optimization DOE was done. Key wire bond parameters include the initial force, USG power etc. The wire pull, ball shear, IMC, Al remnant etc. are key response. The result shows that lower USG and higher initial force can get better wire bond performance. The die was packaged into a MAPBGA package. Electrical test was performed on the assembled parts at T0, post MSL3/260degree C, post 264h UHST (110°C/85%RH), and post TC700cycles (-55°C to 150°C). All units post stress clean passed without any failure. The overall leakage failure rate at ATE test is reduced.
最长约 10秒,即可获得该文献文件

科研通智能强力驱动
Strongly Powered by AbleSci AI
更新
PDF的下载单位、IP信息已删除 (2025-6-4)

科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
余杭村王小虎完成签到,获得积分10
刚刚
韭黄完成签到,获得积分20
4秒前
jeffrey完成签到,获得积分10
4秒前
Rondab应助机灵枕头采纳,获得10
10秒前
佳无夜完成签到,获得积分10
15秒前
摆哥完成签到,获得积分10
19秒前
66完成签到,获得积分10
24秒前
zlqq完成签到 ,获得积分10
24秒前
Hardskills发布了新的文献求助10
27秒前
28秒前
之_ZH完成签到 ,获得积分10
36秒前
gds2021完成签到 ,获得积分10
38秒前
你好呀嘻嘻完成签到 ,获得积分10
38秒前
梅特卡夫完成签到,获得积分10
40秒前
熊雅完成签到,获得积分10
41秒前
43秒前
睡到自然醒完成签到 ,获得积分10
44秒前
cis2014完成签到,获得积分10
46秒前
独特的大有完成签到 ,获得积分10
46秒前
量子星尘发布了新的文献求助10
47秒前
49秒前
xingyi完成签到,获得积分10
51秒前
52秒前
舒心的秋荷完成签到 ,获得积分10
55秒前
zz123发布了新的文献求助10
56秒前
liaomr完成签到 ,获得积分10
56秒前
粗犷的灵松完成签到,获得积分10
57秒前
吃小孩的妖怪完成签到 ,获得积分10
57秒前
ncuwzq完成签到,获得积分10
59秒前
yshj完成签到 ,获得积分10
1分钟前
1分钟前
净禅完成签到 ,获得积分10
1分钟前
1分钟前
迷人的寒风完成签到,获得积分10
1分钟前
1分钟前
water应助科研通管家采纳,获得10
1分钟前
Lucas应助HHHAN采纳,获得10
1分钟前
无情修杰完成签到 ,获得积分10
1分钟前
小柒完成签到 ,获得积分10
1分钟前
聪慧芷巧发布了新的文献求助10
1分钟前
高分求助中
【提示信息,请勿应助】关于scihub 10000
Les Mantodea de Guyane: Insecta, Polyneoptera [The Mantids of French Guiana] 3000
徐淮辽南地区新元古代叠层石及生物地层 3000
The Mother of All Tableaux: Order, Equivalence, and Geometry in the Large-scale Structure of Optimality Theory 3000
Handbook of Industrial Diamonds.Vol2 1100
Global Eyelash Assessment scale (GEA) 1000
Picture Books with Same-sex Parented Families: Unintentional Censorship 550
热门求助领域 (近24小时)
化学 材料科学 医学 生物 工程类 有机化学 生物化学 物理 内科学 纳米技术 计算机科学 化学工程 复合材料 遗传学 基因 物理化学 催化作用 冶金 细胞生物学 免疫学
热门帖子
关注 科研通微信公众号,转发送积分 4038112
求助须知:如何正确求助?哪些是违规求助? 3575788
关于积分的说明 11373801
捐赠科研通 3305604
什么是DOI,文献DOI怎么找? 1819255
邀请新用户注册赠送积分活动 892655
科研通“疑难数据库(出版商)”最低求助积分说明 815022