材料科学
复合材料
多孔性
抗弯强度
微观结构
电介质
化学气相渗透
渗透(HVAC)
陶瓷基复合材料
陶瓷
光电子学
作者
Yang Hu,Fa Luo,Shichang Duan,Wancheng Zhou,Dongmei Zhu
标识
DOI:10.1016/j.ceramint.2016.01.057
摘要
2D KD-1 SiC fiber fabrics were employed to fabricate SiCf/SiC composites by an improved polymer infiltration and pyrolysis (PIP) process, combined with cold isostatic pressing (CIP). The effect of CIP process on the microstructure, mechanical and dielectric properties of SiCf/SiC composites was investigated. The infiltration efficiency was remarkably improved with the introduction of CIP process. Compared to vacuum infiltration, the CIP process can effectively increase the infiltrated precursor content and decrease the porosity resulting in a dense matrix. Thus SiCf/SiC composites with high density of 2.11 g cm−3 and low porosity of 11.3% were obtained at 100 MPa CIP pressure, together with an increase of the flexural strength of the composites from 89 MPa to 213 MPa. Real part (ε′) and the imaginary part (ε″) of complex permittivity of SiCf/SiC composites increase and vary from 11.7-i9.7 to 15.0-i12.8 when the CIP pressure reaches 100 MPa.
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