Effect of DC and AC electric fields on crack healing behavior in 8 mol% yttria‐stabilized cubic zirconia polycrystal

材料科学 氧化钇稳定氧化锆 电场 复合材料 退火(玻璃) 立方氧化锆 应变能释放率 断裂力学 陶瓷 量子力学 物理
作者
Shintaro Kawabata,Shirushi Takahashi,Kohta Nambu,Koji Morita
出处
期刊:Journal of the American Ceramic Society [Wiley]
卷期号:106 (10): 6163-6176
标识
DOI:10.1111/jace.19269
摘要

The effect of the flash event (FE) on microcrack healing behavior in 8 mol% yttria-stabilized zirconia was examined at healing temperatures of 1040 and 1230°C under the direct and alternating (DC and AC) electric fields. The crack healing behavior changed depending on the factors of the electric field, healing temperature, and crack length. Although the crack healing proceeded with the temperature, the healing rate increased with the crack length, suggesting that the external energy stored as crack surface energy would provide a driving force for the crack healing. Although the crack healing occurs even under the static annealing without the electric field, the healing rate was accelerated by FE significantly more under the AC field than under the DC field. The microcracks with a length of ≈20 μm were fully healed at 1230°C only for 10 min by the FE treatment under the AC field, and the flash healing behavior was four times faster than that of the static annealing. These results suggest that the enhanced healing behavior cannot be explained only by thermal effects, and the accelerated diffusivity caused additionally by nonthermal effect under FE might contribute to the enhanced healing behavior, especially in the AC electric field.
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