High‐Temperature Polymer‐Based Dielectrics for Advanced Electronic Packaging

Following Moore's law and beyond, high-performance integrated circuits (ICs) and microchips are being developed in accordance with critical standards such as higher density, higher transmission speed/frequency, miniaturization, environmental friendliness, economic viability, and so forth. Advanced Electronic Packaging techniques could boost the performance of next-generation electronics systems, auxiliary to continuous downscaling of transistors till Moore's limit. Thanks to the ample advantageous properties of polymers including lightweight, cost-effectiveness, easy processability, and diversified functionality, polymer-based dielectrics are playing more and more vital roles in Advanced Electronic Packaging. Apart from excellent dielectric attributes, the thermal properties of polymer dielectrics under high-temperature conditions become ever-crucial. This chapter aims to answer questions as to why high-temperature polymer (HTP) dielectrics are important, what kinds of polymers could qualify as high-temperature packaging dielectrics, how the properties of polymer dielectrics could be enhanced, and so on, accompanied by some exemplified examples.