Failure Analysis in Advanced Driver Assistance Systems

Failure analysis (FA) could provide timely feedback to process optimization and solution paths for system failures; thus, it is critical for the development of advanced driver assistance systems (ADAS). In this chapter, failure analysis flows starting from systems or boards until components or packages and dice are introduced. Electrical fault isolation (FI) techniques designed to locate subtle defects inside complicated semiconductor devices are reviewed. Physical failure analysis approaches adopted to provide artifact free nanometer scale analysis are discussed. Material analysis methods assisting in thorough root cause investigation are presented. Non-destructive and high-resolution imaging tools with the potential of significantly shortening failure analysis through put time are demonstrated. Case studies are used to illustrate strategies and methodologies in ADAS failure analysis.