材料科学
碳化硅
功率(物理)
半导体器件
使用寿命
半导体
温度循环
结温
可靠性(半导体)
电源模块
功率损耗
功率半导体器件
工作(物理)
可靠性工程
光电子学
工程物理
自行车
动力循环
机械工程
工程类
纳米技术
热力学
冶金
物理
复合材料
考古
历史
热的
图层(电子)
作者
Felix Hoffmann,Nando Kaminski
出处
期刊:Materials Science Forum
日期:2020-07-01
被引量:5
标识
DOI:10.4028/www.scientific.net/msf.1004.977
摘要
In this work, the three most common lifetime models for power semiconductors i.e. LESIT, CIPS08 and SKiM63 are investigated regarding their applicability for SiC power devices. For this reason, multiple power cycling tests with a large number of devices were performed. The results show that those models can properly reflect the power cycling test results of SiC power semiconductors for higher temperature swings if the model parameter are properly adjusted. However, they show a significant error for lower temperature swings and drastically underestimate the lifetime. This indicates that the inferior power cycling performance of SiC power devices compared to silicon at high temperature swings does not necessarily imply that the service life is affected in the same order of magnitude.
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