Understanding Transport in Hole Contacts of Silicon Heterojunction Solar Cells by Simulating TLM Structures

材料科学 异质结 肖特基势垒 光电子学 硅 热离子发射 太阳能电池 兴奋剂 电阻率和电导率 非晶硅 晶体硅 氧化铟锡 量子隧道 接触电阻 半导体 电子迁移率 肖特基二极管 图层(电子) 纳米技术 二极管 电子 电气工程 物理 量子力学 工程类
作者
Pradyumna Muralidharan,Mehdi Leilaeioun,William Weigand,Zachary C. Holman,Stephen M. Goodnick,Dragica Vasileska
出处
期刊:IEEE Journal of Photovoltaics [Institute of Electrical and Electronics Engineers]
卷期号:10 (2): 363-371 被引量:22
标识
DOI:10.1109/jphotov.2019.2957655
摘要

Silicon heterojunction (SHJ) solar cell device structures use carrier-selective contacts that enable efficient collection of majority carriers while impeding the collection of minority carriers. However, these contacts can also be a source of resistive losses that degrade the performance of the solar cell. In this article, we evaluate the performance of the carrier-selective hole contact- hydrogenated amorphous silicon (a-Si:H)(i)/a-Si:H(p)/indium tin oxide (ITO)/Ag-by simulating transport in SHJ solar cell transfer length method structures. We study contact resistivity behavior by varying the a-Si:H(i) layer thickness, ITO(n±) and a-Si:H(p) layer doping, temperature, and interface defect density at the a-Si:H(i)/ crystalline silicon (c-Si) interface. In particular, we consider the effect of ITO/a-Si:H(p) and the a-Si:H(i)/c-Si heterointerfaces on contact resistivity as they play a crucial role in modulating transport through the hole contact structure. Transport models such as band-to-band tunneling, and thermionic emission models were added to describe transport across the heterointerfaces. Until now, most simulation studies have treated the ITO as a Schottky contact; in this article, we treat the ITO as an n-type semiconductor. Our simulations match well with corresponding experiments conducted to determine contact resistivity. As the a-Si:H(i) layer thickness is increased from 4 to 16 nm, the simulated contact resistivity increases from 0.50 to 2.1 Ωcm 2 , which deviates a maximum of 8% from the experimental measurements. It should be noted that we calculate the contact resistivity for the entire hole contact stack, which takes into account transport across the a-Si:H(p)/c-Si and ITO/a-Si:H(p) heterointerface. Corresponding experiments on cell structures showed a fill factor degradation from 77% to 70%. Our simulations indicate that a highly doped n-type ITO layer facilitates tunneling at the ITO/a-Si:H(p) heterointerface, which leads to low contact resistivities.
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