石墨烯
异质结
材料科学
范德瓦尔斯力
热导率
热传导
热的
凝聚态物理
化学物理
纳米技术
声子
光电子学
热力学
化学
复合材料
物理
分子
有机化学
作者
Hao Ma,Hasan Babaei,Zhiting Tian
出处
期刊:Carbon
[Elsevier]
日期:2019-07-01
卷期号:148: 196-203
被引量:21
标识
DOI:10.1016/j.carbon.2019.03.076
摘要
Graphene-C60 heterostructures assembled by van der Waals (vdW) interactions between graphene and C60 have shown exciting potential for multifunctional devices. Understanding thermal transport in graphene-C60 heterostructures is the key to guiding the design of vdW heterostructures with desired thermal transport properties. In this work, we report the first study of thermal transport in a graphene-C60 heterostructure and elucidate the importance of vdW interactions to heat conduction using molecular dynamics simulations. We find that the in-plane thermal conductivity of the graphene-C60 heterostructure is as high as about 234 W/(mK) at room temperature, exceeding those of most pure metals. As the vdW interaction parameter, χ, varies from 0.1 to 2, the in-plane thermal conductivity first increases then decreases. On the other hand, as vdW interactions increases, the interfacial thermal conductance between graphene and C60 is enhanced. Our study demonstrates that graphene-C60 heterostructures have high in-plane thermal conductivity and their interfacial thermal conductance is comparable to that of graphene-hexagonal boron-nitride (hBN) heterostructure. Graphene-C60 heterostructures are promising candidates for multifunctional devices with inherent heat dissipation capability.
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