联锁
联锁
材料科学
复合材料
复合数
极限抗拉强度
制作
抗弯强度
环氧树脂
卷曲
图层(电子)
结构工程
医学
工程类
病理
替代医学
作者
Muhammad Umair,Syed Talha Ali Hamdani,Muhammad Ayub Asghar,Tanveer Hussain,Mehmet Karahan,Yasir Nawab,Mumtaz Ali
标识
DOI:10.1177/0731684417751059
摘要
Three-dimensional multilayer woven composites are mostly used in high-performance applications due to their excellent out-of-plane mechanical performance. The current research presents an experimental investigation on the mechanical behavior of three-dimensional orthogonal layer-to-layer interlock composites. The glass filament yarn and carbon tows were used as reinforcement in warp and weft directions respectively, whereas epoxy was used as a resin for composite fabrication. Three different types of orthogonal layer to layer interlock namely warp, weft, and bi-directional interlock composites were fabricated and the effect of interlocking pattern on their mechanical performance was evaluated. The evaluation of the mechanical performance was made on the basis of tensile strength, impact strength, flexural strength, and dynamic mechanical analysis of composites in warp and weft directions. It was found that warp and weft interlock composites showed better tensile behavior as compared to bi-directional interlock composite both in the warp and weft directions, due to the presence of less crimp as compared to the bi-directional interlock composite. However, the bi-directional interlock composite exhibited considerably superior impact strength and three-point bending strength as compared to the other structures under investigation. These superior properties of bi-directional interlock composites were achieved by interlocking points in warp and weft directions simultaneously, creating a more compact and isotropic structure. Tan delta values of dynamic mechanical analysis results showed that bi-directional interlock composite displayed the highest capacity of energy dissipation in the warp and weft directions while weft interlock structures displayed highest storage and loss moduli in the warp direction.
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