聚酰亚胺
均苯四甲酸二酐
材料科学
玻璃化转变
热稳定性
聚合物
高分子化学
二胺
氢键
有机发光二极管
热膨胀
分子间力
化学工程
极限抗拉强度
侧链
复合材料
分子
有机化学
化学
工程类
图层(电子)
作者
Yang Zhenghui,Pingchuan Ma,Furong Li,Haiquan Guo,Chuanqing Kang,Lianxun Gao
标识
DOI:10.1016/j.eurpolymj.2021.110369
摘要
The flexibility of organic light-emitting diode (OLED) displays highly depends on the properties of the flexible substrates. In this paper, a series of aromatic polyimides have been fabricated via the copolycondensation of pyromellitic dianhydride (PMDA), the two different rigid heterocyclic diamines, 2,5-bis(4-aminophenyl)pyrimidine (PRM) or 2,5-bis(4-aminophenyl)pyridine (PRD), and another flexible diamine, 4,4′-oxydianiline (ODA). The performance of the polyimide films could be systematically tailored by means of adjusting the main-chain rigidity, as well as the close packing and orientation of polymer chains by the formation of the intermolecular hydrogen bonds between poly(amic acid)s. The optimal results (PIb-4, PIb-5, PIc-2) showed that the polyimides were endowed with ultra-high glass transition temperature (Tg) exceeding 450 °C, low coefficient of thermal expansion (CTE) at 0–5 ppm K−1 and excellent thermal stability (Td5% = 570–590 °C). Meanwhile, all of them exhibited sufficient flexibility, the elongation at break at of 40–60%, extremely high tensile strength of 250–380 MPa and modulus of 4.1–6.1 GPa. Hence, the polyimide films should be the promising candidates for application as the polymer substrates for flexible OLED displays.
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