Innovative Fabrication of Metal Alloy Structures via Laser‐Induced Forward Transfer on Flexible Substrates

Abstract Laser‐induced forward transfer is a contactless, nozzle free process which enables accurate, precise and fast development of 3D structures. However, a number of shortcomings such as shockwave generation, poor adhesion to receiver substrates and uniform depositions limit LIFT to be utilized. Therefore, this research tends to put forward easy and effective solutions for successful mitigation of the LIFT limitations. Receiver surface modifications and low‐pressure conditions are introduced through laser surface texturing (LST) and a vacuum pump. A number of textures and orientations are investigated for determining the optimal copper (Cu) deposition. Furthermore, utilization of the same laser system for LST enables the manufacturing process cost and time effective. In addition to Cu depositions, additive layers of silver (Ag) and platinum (Pt) are deposited. Finally, Ag and Pt micropillars are fabricated on their respective additive layers leading to formation of Cu‐Ag and Cu‐Pt alloys structure. Subsequently, electrical and material characterizations are made to validate for potential applications. Experimental evidence shows greater adhesion with electrical properties for LST‐based LIFT in low pressure conditions. Finally, an energy analysis is performed based on theoretical and finite element methods (FEM) to gain greater insights into mechanics of the LIFT process.