材料科学
结晶
硅化物
退火(玻璃)
高-κ电介质
金属浇口
光电子学
工作职能
扩散
阿累尼乌斯方程
CMOS芯片
锡
堆栈(抽象数据类型)
镧
电子工程
工程物理
栅氧化层
电介质
晶体管
电气工程
活化能
纳米技术
电压
冶金
图层(电子)
热力学
计算机科学
硅
化学
物理化学
无机化学
程序设计语言
工程类
物理
作者
Meng Zhu,Balaji Kannan,Yibin Zhang,Manasa Medikonda,Yifan Liang,Jinghong Li,Aritra Dasgupta,L. Pantisano,Merve Ozbek,S. Siddiqui,Jinping Liu
出处
期刊:ECS transactions
[The Electrochemical Society]
日期:2018-04-10
卷期号:85 (8): 131-136
被引量:3
标识
DOI:10.1149/08508.0131ecst
摘要
La2O3 has been selected as a threshold voltage (Vt) tuning material for advanced CMOS node because of its uniqueness of reducing effective work function towards nFET band edge by creating dipoles at SiO2/HfO2 interface. In this paper, we study the factors which influence the diffusion of La into HfO2-based gate stack during drive-in anneal. These factors include: (1) Initial La2O3 thickness, HfO2 thickness and drive-in anneal temperature; (2). Crystallization state of HfO2; (3) Capping material during drive-in anneal. While La diffusion generally follows thermally activated process described by Fick's law and Arrhenius equation, the crystallization of HfO2 and the TiN cap adjacent to La2O3 are also found to greatly affect the amount of diffused La, which ties closely to the Vt tuning ability.
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