材料科学
放电等离子烧结
复合材料
热膨胀
相对密度
复合数
石墨
压痕硬度
热导率
烧结
铝
微观结构
作者
Mondiu Ọlayinka Durowoju,T. B. Asafa,Rotimi Sadiku,S. Diouf,Mxolisi Brendon Shongwe,P. A. Olubambi,K. O. Oladosu,A Ogbemudia,MM Babalola,M. T. Ajala
标识
DOI:10.1177/0021998319892058
摘要
Graphite–aluminium (Gr–Al) composites are being used for diverse engineering applications because of their light weight, good electrical conductivity and thermal properties. However, their applications are limited by high coefficient of thermal expansion and low microhardness values which can be enhanced by adding cheap and efficient fillers. This paper reports the effect of addition of eggshell (ES) particles on the properties of sintered Gr–Al-based composites. Five different composites (Gr–Al, Gr–Al + 20 wt.%Si, Gr–Al + 20 wt.%SiC, Gr–Al + 20Si wt.% + 20 wt.%ES and Gr–Al + 20SiC wt.% + 20 wt.%ES) were sintered at a temperature of 540 ℃, holding time of 10 min, heating rate of 52 ℃/min and pressure of 50 MPa using spark plasma sintering system. The sintered samples were characterized based on morphology, microhardness, relative density, coefficient of thermal expansion and electrical conductivity. Based on SEM images, graphite particles of flake-like structure were largely undeformed while Al particles were smaller, round and irregular in shape and fairly uniformly distributed in the composites. The microhardness value of sintered Gr–Al + 20 wt.%SiC + 20 wt.%ES composite was 39.55 HV compared to 30.46 HV for Gr–Al, the least of the samples. The Gr–Al + 20 wt.%SiC + 20 wt.%ES composite also has a very low thermal expansion coefficient (0.98 × 10 −5 /K) but lowest electrical conductivity at temperature beyond 150 ℃. Highest densification and minimum relative density (94%) were obtained in Gr–Al + 20 wt.%Si + 20 wt.%ES composite. These enhanced performances are largely due to the incorporation of ES particles. This study therefore demonstrated that ESs particles enhanced microhardness and lowered thermal expansion of Gr–Al-based composites which have promising applications in industries especially for thermal management.
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