固化(化学)
材料科学
3D打印
聚合
复合材料
阳离子聚合
聚合物
高分子化学
作者
Weizi Gao,Yunlong Guo,Jingjing Cui,Liang Chen,Zhe Lü,Shiwei Feng,Yongding Sun,Qixing Xia,Biao Zhang
标识
DOI:10.1016/j.addma.2024.104142
摘要
Photo-curing 3D printing technologies use a specific wavelength light source to trigger the polymerization of photosensitive resins, with the advantages of rapid curing and excellent spatial resolution. However, photo-curing materials based on the free radical polymerization suffer from brittleness and poor impact resistance, while those based on the cationic polymerization mechanisms are constrained by slow curing speed. Dual-curing materials are hybrid resins consisting of photosensitive and thermal curing resins that take into account fast curing speeds and excellent mechanical properties, which have been widely used in photo-curing 3D printing in recent years, and their application fields are gradually expanding. Herein, dual-curing materials used in photo-curing 3D printing are reviewed. The reaction mechanisms generally involved in photo-curing and thermal-curing are given first. Subsequently, the techniques of photo-curing 3D printing as well as UV-assisted 3D printing are summarized. By following, dual-curing with different sequential combinations of photo and thermal curing compositions are discussed in detail. Finally, recent progress on photo/thermal dual-curing materials for variety of applications are presented to further inspire the extensive development of dual-curing materials in 3D printing and future opportunities for post-print modification.
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