中间层
化学机械平面化
材料科学
温度循环
堆栈(抽象数据类型)
压力(语言学)
聚合物
电子包装
热的
电子工程
复合材料
光电子学
图层(电子)
计算机科学
蚀刻(微加工)
工程类
语言学
哲学
物理
气象学
程序设计语言
作者
Yuan-Chiu Huang,Yu-Xian Lin,Chien-Kang Hsiung,Yutao Yang,Tzu‐Heng Hung,Kuan‐Neng Chen
出处
期刊:IEEE Electron Device Letters
[Institute of Electrical and Electronics Engineers]
日期:2024-01-10
卷期号:45 (3): 452-455
被引量:2
标识
DOI:10.1109/led.2024.3352252
摘要
To minimize warpage in the multilayer-RDL interposers, a novel approach called hyper RDL (HRDL) is proposed. The HRDL utilizes a low temperature hybrid bonding method to stack RDL layers, reducing the warpage by at least 20X as compared to the conventional semi-additive processes (SAP). The HRDL based on polymer-based hybrid bonding was demonstrated as low as 180 °C under atmosphere with a bonding strength of 47.83 kgf/cm 2 . Both the thermal cycling of 1000 cycles and the un-biased highly accelerated stress test of 168 hours showed less than 1.5% change in electrical resistance. The HRDL process flow is designed to ensure reasonable running costs without the need for polymer chemical mechanical planarization (CMP). This innovative approach leads to a low-warpage RDL interposer platform for advanced packaging applications.
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