共形矩阵
可穿戴计算机
抗压强度
材料科学
钢筋
导电体
压缩(物理)
压缩传感
计算机科学
复合材料
纳米技术
嵌入式系统
人工智能
作者
Zhichao Yang,Ziqiang Qin,Menglu Wu,Haimin Hu,Pengcheng Nie,Yong Wang,Qilei Li,Di Wu,Yong He,Kunsong Chen
标识
DOI:10.1016/j.jare.2024.09.002
摘要
The conductive hydrogel holds promise for applications in smart packaging, wherein it can detect crucial mechanical stress on fruit, convert it into electrical signals, and further transmit these signals to the cloud, thereby enabling the real-time sensing of mechanical forces experienced by fruits and enhancing post-harvest fruit loss management.
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