数码产品
柔性电子器件
材料科学
信号(编程语言)
可穿戴计算机
可穿戴技术
粘附
可伸缩电子设备
计算机科学
纳米技术
电气工程
嵌入式系统
工程类
复合材料
程序设计语言
作者
Geonjun Choi,Jaeil Kim,Hyunjoong Kim,Haejin Bae,Baek‐Jun Kim,Hee Jin Lee,Hyejin Jang,Minho Seong,Salah M. Tawfik,Jae Joon Kim,Hoon Eui Jeong
标识
DOI:10.1002/adma.202412271
摘要
Abstract Skin‐interfaced electronics have emerged as a promising frontier in personalized healthcare. However, existing skin‐interfaced patches often struggle to simultaneously achieve robust skin adhesion, adaptability to dynamic body motions, seamless integration of bulky devices, and on‐demand, damage‐free detachment. Here, a hybrid strategy that synergistically combines these critical features within a thin, flexible patch platform is introduced. This design leverages shape memory polymers (SMPs) arranged in a tessellated array, comprising both rigid and compliant SMPs. This configuration enables exceptional deformability, motion adaptability, and ultra‐strong, repeatable skin adhesion while offering on‐demand adhesion control. Furthermore, the design facilitates the seamless integration of bulky electronics without compromising skin adhesion. By incorporating sizeable electronics including signal acquisition circuits, sensors, and a battery, it is demonstrated that the proposed tessellated patch can be securely mounted on the skin, accommodate dynamic body motions, precisely detect physiological signals with an outstanding signal‐to‐noise ratio (SNR), wirelessly transmit data, and be effortlessly released from the skin.
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