Deformation behavior and interface analysis of SiCp/Al composites by vibration cutting based on molecular dynamics

To study the deformation behavior of SiCp/Al composite material and the analysis of al-sic interface by vibration cutting with diamond (PCD) tool, a simulation model of vibration cutting of SiCp/Al composite material was established by using molecular dynamics (MD) method. By analyzing the workpiece removal mode, crystal phase transformation and micro-region of Al-sic interface was studied. By comparing the radial distribution function, Von Mises stress, temperature and dislocation distribution of the workpiece under normal cutting and vibration cutting, the deformation behavior of SiCp/Al composites during cutting was studied, and the influence of vibration cutting on the deformation of the workpiece was also analyzed. The results show that the presence of SiC particles causes the workpiece to have obvious plastic deformation during cutting, and the stress concentration leads to the separation of Al-SiC interface and the dissticking phenomenon. During vibration cutting, there was stronger bonding ability between atoms. The intermittent cutting reduced Von Mises stress and dislocation distribution, and the thermal softening effect of vibration cutting reduced the damage to Al-SiC interface atom bonding, which was conducive to the occurrence of crystal plastic deformation and made the workpiece reach a more stable state. Through the above analysis, the structural characteristics and deformation behavior of Al-SiC interface micro-region are revealed, which provides a theoretical basis for improving the stability of the interface.